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Published on 2/13/2024 in the Prospect News Emerging Markets Daily.

New Issue: Lima Infrastructure Trust issues S/. 1.205 billion of 10.1% securitization bonds

By Mary-Katherine Stinson

Lexington, Ky., Feb. 13 – Credicorp Capital Sociedad Titulizadora SA announced that the special purpose vehicle Lima Infrastructure Trust issued S/. 1.205 billion, or approximately $325 billion, of 10.1% securitization bonds due Dec. 15, 2043, according to a notice and a press release from Shearman & Sterling.

The bonds were issued on Dec. 27 and will be listed on the Singapore Exchange effective Feb. 14.

The proceeds are intended to finance a portfolio of 42 prioritized investment projects, which will contribute to closing gaps in infrastructure and public services and repay existing debt.

Lima Infrastructure is a special purpose vehicle created for the securitization program of up to S/. 4 billion Alcabala Tax and Motor Vehicle Tax by the Metropolitan Municipality of Lima.

Issuer:Lima Infrastructure Trust
Amount:S/. 1.205 billion
Issue:Bonds
Maturity:Dec. 15, 2043
Trustee:Credicorp Capital Sociedad Titulizadora SA
Counsel to issuer:Shearman & Sterling
Coupon:10.1%
Settlement date:Dec. 27
Listing date:Feb. 14
ISIN:US224939AA67

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