By Mary-Katherine Stinson
Lexington, Ky., Feb. 29 – Chongqing Tongnan Construction Engineering (Group) Co., Ltd. issued RMB 200 million 4.8% credit enhanced bonds due Feb. 28, 2027, according to a listing notice.
Listing of the bonds is expected on the Singapore Exchange effective March 1.
The issuer is based in Chongqing, China, and is responsible for infrastructure construction within the region.
| Issuer: | Chongqing Tongnan Construction Engineering (Group) Co., Ltd.
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| Amount: | RMB 200 million
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| Issue: | Bonds
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| Maturity: | Feb. 28, 2027
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| Coupon: | 4.8%
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| Issue date: | Feb. 29
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| Listing date: | March 1
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| ISIN: | HK0000980109
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