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Published on 5/7/2019 in the Prospect News Emerging Markets Daily.

New Issue: China’s Chengdu Tianfu sells $300 million 4.65% bonds due 2024

By Sarah Lizee

Olympia, Wash., May 7 – Chengdu Tianfu New Area Investment Group Co., Ltd. sold $300 million of 4.65% bonds due 2024, according to an announcement.

China International Capital Corp. and ICBC International are joint global coordinators, joint lead managers and joint bookrunners.

Application was made to the Stock Exchange of Hong Kong Ltd. for listing, which is expected for May 8.

The bonds were rated Baa3 by Moody’s Investors Service. The agency said in a press release that the proceeds from the issue would be used for project construction in China, repayment of existing debt and general corporate purposes.

Chengdu Tianfu New Area Investment Group is a Chengdu, China-based provider of infrastructure construction services.

Issuer:China Construction Bank Corp.
Issue:Bonds
Amount:$300 million
Maturity:2024
Bookrunners:China International Capital Corp. and ICBC International
Coupon:4.65%
Announcement date:May 7
Ratings:Moody’s: Baa3

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