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Published on 6/29/2015 in the Prospect News Emerging Markets Daily.

New Issue: Chinlink International to place HK$200 million 7.5% bonds due 2017

New York, June 29 – Chinlink International Holdings Ltd. plans to sell up to HK$200 million of two-year bonds with a 7.5% coupon at par.

The bonds will be placed on a best-efforts basis by agent Emperor Securities Ltd.

The placing period ends on Aug. 31.

Proceeds from the issuance will be used to refinance existing borrowings and for working capital.

Hong Kong-based Chinlink has businesses in interior decorating in Hong Kong and Macau, in international trade, in financing guarantee services and in logistics.

Issuer:Chinlink International Holdings Ltd.
Issue:Bonds
Amount:HK$200 million
Maturity:2017
Coupon:7.5%
Price:Par
Call:At any time at par
Placement agent:Emperor Securities Ltd.
Pricing date:June 29

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