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Taiwan Semiconductor plans up to NT$35 billion of corporate bonds
By Marisa Wong
Madison, Wis., Aug. 9 - Taiwan Semiconductor Manufacturing Co., Ltd. announced that its board of directors approved the issuance of up to NT$35 billion of straight corporate bonds.
The bonds will be issued at par.
Proceeds will be used for general corporate purposes.
The semiconductor manufacturer is based in Hsinchu, Taiwan.
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