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Published on 8/9/2011 in the Prospect News Emerging Markets Daily.

Taiwan Semiconductor plans up to NT$35 billion of corporate bonds

By Marisa Wong

Madison, Wis., Aug. 9 - Taiwan Semiconductor Manufacturing Co., Ltd. announced that its board of directors approved the issuance of up to NT$35 billion of straight corporate bonds.

The bonds will be issued at par.

Proceeds will be used for general corporate purposes.

The semiconductor manufacturer is based in Hsinchu, Taiwan.


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